Silicon Institute of Technology

Results: 113



#Item
31FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM  WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one  sealed by bonding of a cap wafer onto

FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto

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Source URL: www.izm.fraunhofer.de

Language: English - Date: 2013-01-18 04:01:57
32

PDF Document

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Source URL: www.cl.cam.ac.uk

Language: English - Date: 2012-08-15 05:37:20
33HIGH-Q INTEGRATED INDUCTORS ON TRENCHED SILICON ISLANDS Mina Raieszadeh, Pejman Monajemi, Sang-Woong Yoon, Joy Laskar, and Farrokh Ayazi School of Electrical and Computer Engineering, Georgia Institute of Technology, Atl

HIGH-Q INTEGRATED INDUCTORS ON TRENCHED SILICON ISLANDS Mina Raieszadeh, Pejman Monajemi, Sang-Woong Yoon, Joy Laskar, and Farrokh Ayazi School of Electrical and Computer Engineering, Georgia Institute of Technology, Atl

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Source URL: www.ece.gatech.edu

Language: English - Date: 2009-04-01 18:28:30
34Two-body and three-body abrasive wear behaviour of polyaryletherketone composites A.P. Harsha, U.S. Tewari * Industrial Tribology, Machine Dynamics and Maintenance Engineering Centre, Indian Institute of Technology, Hauz

Two-body and three-body abrasive wear behaviour of polyaryletherketone composites A.P. Harsha, U.S. Tewari * Industrial Tribology, Machine Dynamics and Maintenance Engineering Centre, Indian Institute of Technology, Hauz

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Source URL: eprint.iitd.ac.in

Language: English - Date: 2006-01-09 15:30:13
3540 Gb/s high speed silicon modulator for TE and TM polarisation F. Y. Gardes, D. J. Thomson, G. T. Reed Advanced Technology Institute, University of Surrey, Guildford, Surrey, UK  Abstract

40 Gb/s high speed silicon modulator for TE and TM polarisation F. Y. Gardes, D. J. Thomson, G. T. Reed Advanced Technology Institute, University of Surrey, Guildford, Surrey, UK Abstract

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Source URL: epubs.surrey.ac.uk

Language: English - Date: 2013-09-23 14:52:14
36INSTITUTE OF PHYSICS PUBLISHING  JOURNAL OF MICROMECHANICS AND MICROENGINEERING J. Micromech. Microeng[removed]S91–S95

INSTITUTE OF PHYSICS PUBLISHING JOURNAL OF MICROMECHANICS AND MICROENGINEERING J. Micromech. Microeng[removed]S91–S95

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Source URL: www.ee.washington.edu

Language: English - Date: 2003-07-02 16:59:00
37Two-way Bridge between the European EIT ICT Labs ecosystem and Silicon Valley supporting the exchange of talents, ideas, technology and investments Growing Co-Location Centers Creating team spirit through physically

Two-way Bridge between the European EIT ICT Labs ecosystem and Silicon Valley supporting the exchange of talents, ideas, technology and investments Growing Co-Location Centers Creating team spirit through physically

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Source URL: destinationeurope-sanjose.teamwork.fr

Language: English - Date: 2015-02-13 08:00:51
38Life Sciences  IT Environment

Life Sciences IT Environment

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Source URL: www.mext.go.jp

Language: English - Date: 2008-12-04 01:44:27
39CANES-­‐MIT	
  Workshop	
  on	
  	
    Silicon	
  Carbide	
  Modeling	
  (SiC)	
     December	
  4	
  –	
  5,	
  2014	
  	
   Boston	
  Marriott	
  Cambridge	
  —	
  50	
  Broadway	
  Cambridg

CANES-­‐MIT  Workshop  on     Silicon  Carbide  Modeling  (SiC)     December  4  –  5,  2014     Boston  Marriott  Cambridge  —  50  Broadway  Cambridg

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Source URL: canes.mit.edu

Language: English - Date: 2015-01-15 12:14:59
40Association of Independent Technological Universities / San Francisco Bay Area / Information Age / Santa Clara County /  California / Silicon Valley / Venture capital / Massachusetts Institute of Technology / Internship / Geography of California / Education / Association of American Universities

Feedback on Godfrey’s presentation about STEM: A time-line has been laid out for this new STEM neighborhood (between[removed]QUE: How do the schools view each other, and what about the cultural issues and territo

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Source URL: scu.edu

Language: English - Date: 2014-11-10 12:32:52